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Subject:	Re: Wire bondable gold
From:	Glenn Pelkey <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Thu, 25 Aug 2005 07:29:59 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (61 lines)

Hi Steve,

For gold wire bonding, we use both full electrolytic and electroless
processes.  That is Electrolytic Ni/Electrolytic Au and Electroless
Ni/Electroless Au.  We haven't tried Electroless Ni/Electrolytic Au or
Electrolytic Ni/Electroless Au.  Not sure if that would ever come up.
Thickness, purity, and hardness are the key to good bondability with gold.

Glenn

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Thursday, August 25, 2005 6:31 AM
To: [log in to unmask]
Subject: [TN] Wire bondable gold


Good day to all,

Does it make any difference if the nickel underneath the wire bondable gold
is electroplated or electroless?  Thanks in advance. Steve Kelly



PFC Flexible Circuits Limited

Ph: (416) 750-8433

Fax: (416) 750-0016

Cell: (416) 577-8433

E-Mail: [log in to unmask]




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