I recall issues with wedge bonding to the harder electroless nickel.
Electrolytic nickel accepts the aluminum wire more readily and has
better bonding/reliability.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice: 802.257.4571.21 Fax: 802.257.0011
http://www.vtcircuits.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leo Higgins
Sent: Thursday, August 25, 2005 9:52 AM
To: [log in to unmask]
Subject: Re: [TN] Wire bondable gold
Both are bondable so long as the Au is thick enough. Typical immersion
Au
thicknesses are not bondable over e'less Ni.
Best regards,
Leo
Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas 78704
ph 512-383-4593
fx 512-383-1590
[log in to unmask]
www.asat.com
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Kelly
Sent: Thursday, August 25, 2005 8:31 AM
To: [log in to unmask]
Subject: [TN] Wire bondable gold
Good day to all,
Does it make any difference if the nickel underneath the wire bondable
gold
is electroplated or electroless? Thanks in advance. Steve Kelly
PFC Flexible Circuits Limited
Ph: (416) 750-8433
Fax: (416) 750-0016
Cell: (416) 577-8433
E-Mail: [log in to unmask]
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