Ramon,
Do you use USC to remove flux residue of populated boards? If so, what kind
of components are on the boards (QFPS, QFNs, BGAs, microBGAs, etc.)
Thank you for your input
David
(847) 858-5540, Cell
>From: "Dehoyos, Ramon" <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>, "Dehoyos,
>Ramon" <[log in to unmask]>
>To: [log in to unmask]
>Subject: Re: [TN] Question on cleaning boards with BGA.
>Date: Wed, 3 Aug 2005 10:42:36 -0400
>
> Richard:
> I am glad that you are sharing this info with everyone else. I
>think the US cleaning is fantastic. It really removes particles that
>other wise would take a lot of chemicals or mechanical scrub. Maybe it
>will be used as a standard cleaning someday and save the industry lots
>of money.
> Ramon
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard
>Sent: Wednesday, August 03, 2005 10:07 AM
>To: [log in to unmask]
>Subject: Re: [TN] Question on cleaning boards with BGA.
>
>Ramon,
>It is of a different frequency. When I first purchased it, I bought it
>from Crest Ultrasonics in North Dakota. The tech rep was very
>knowledgeable. He told me that it operated at a different frequency from
>the Branson units, and it would not harm (or be less likely to harm) the
>components. I do not recall the frequency, but I am sure they can pass
>that info on. An excellent article was written about this and is listed
>in the American Competitiveness Institute (ACI) archives available
>online. I purchased these Crest units for two companies I used to work
>for, and I was told that they have been working extremely well. It has
>now been 4 years since I purchased the first unit.
>What did you mean by "US cleaning is a noon for PWAs"?
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
>Sent: Wednesday, August 03, 2005 8:34 AM
>To: [log in to unmask]
>Subject: Re: [TN] Question on cleaning boards with BGA.
>
> Hi Richard:
>
> I have known from different sources including this forum that US
>cleaning is a noon for PWAs. I read an article from China that they have
>developed a US cleaning using a different frequency that does not damage
>components of any kind. It seems that your US cleaner might be of the
>frequency that does not damage components.
>
> Regards,
> Ramon
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard
>Sent: Wednesday, August 03, 2005 8:46 AM
>To: [log in to unmask]
>Subject: Re: [TN] Question on cleaning boards with BGA.
>
>I actually have component application info from at least two BGA
>manufacturers that include US cleaning info, and one (Intel) actually
>recommends cleaning with US and a mix of hot de-ionized water mixed with
>a saponifier. So I question the statement that US causes cracked solder
>joints. I do know that it can damage certain components with a resonant
>cavity.
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
>Sent: Wednesday, August 03, 2005 7:39 AM
>To: [log in to unmask]
>Subject: Re: [TN] Question on cleaning boards with BGA.
>
>Hi Paul! What is the physics behind the ultrasonic cleaning system
>causing cracked BGA solder joints? Is your comment based on published
>data or internal data?
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]
>
>
>
>
> Paul Edwards
> <paul@SURFACE-ART
> .COM>
>To
> Sent by: TechNet [log in to unmask]
> <[log in to unmask]>
>cc
>
>
>Subject
> 08/02/2005 09:41 Re: [TN] Question on cleaning
> PM boards with BGA.
>
>
> Please respond to
> TechNet E-Mail
> Forum
> <[log in to unmask]>
> ; Please respond
> to
> Paul Edwards
> <paul@SURFACE-ART
> .COM>
>
>
>
>
>
>
>Never use an ultrasonic cleaning system with BGAs unless you want to
>generate cracked solder joints...
>
>Assuming your ECN is at the former label location which is why you need
>complete adhesive removal... find out from your label supplier what type
>of adhesive they are using and have them suggest something...
>
>We use an alcohol/glycol/water mix to remove most label adhesives...
>
>Paul Edwards
>Surface Art Engineering
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of David Harman
>Sent: Tuesday, August 02, 2005 4:58 PM
>To: [log in to unmask]
>Subject: [TN] Question on cleaning boards with BGA.
>
> We are remanufacturing (reworking some of product) due to an ECR
>release. We apply a label with non-conductive adhesive that once
>removed leaves adhesive on the PCBA. This adhesive prevents the board
>from passing due to not making contact. The current process requires an
>operator to use IPA and a soft scrub to remove it. This process is time
>consuming. My CM has suggested that we ultrasonic the boards using S-10
>solvent.
>
>
>
>My boards have BGAs, interconnect pins, and switches along with the
>normal SMT parts. Will using this s-10 solvent in an ultrasonic cleaner
>work, and will it not cause any reliability issues with BGAs or other
>parts on the boards?
>
>
>
>Anyone have any other suggestions for auto cleaning my boards to remove
>the adhesive. We use the no clean process.
>
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