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August 2005

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Subject:
From:
Poh Kong Hui <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Poh Kong Hui <[log in to unmask]>
Date:
Tue, 23 Aug 2005 20:03:50 +0800
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Hi,

My past experience was that the outgassing from the BGA that cause the BGA
to "jump" off the pads.

I am not sure if you are facing the same symptom that I had. Anyway, bake
the BGA will kill off the "hopping". It also can happen to other kind of
components.

Good Luck !

KH Poh



At 08:15 AM 8/22/05 +0700, Le Thanh Tung wrote:
>Hello everybody.
>At present, we are facing to one problem as below:
>BGA component is shifted after go through reflow machine.
>We have checked 100% mounting condition at BGA location before reflow, we
>sure the BGA is not shifed but after reflow the shifted part defect still
>happened.
>although we lost much time to investigate but the problem is still not be
>overcome.
>The detail of BGA is as below:
>    - BGA size: 15 x 15
>    - Pitch: 1 mm
>    - Ball dia.: 0.49 mm
>    - Product: RoHS PCBA
>Anyone who have this experience?
>Thanks
>
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