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Date: | Tue, 23 Aug 2005 20:37:53 EDT |
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All
We who work with these things have varied success with the
elctroless/immersion combinations of Nickel/ Palladium/Gold. On the other hand the
electrolytic nickel/palladium/gold has had very good success in the downhole oil well
drilling tool industry. The electronic units that go down the hole with the
drilling tools have an environment up to 175oC and sometimes up to 200oC for
many hundreds of hours. I have seen results of many hours of testing on many
test and operational unit's after aging at these temperatures and have never
seen a case of black pad. The solder or the component lead is the major cause
of failure and not board plating. For the application it is difficult to
find a solder that will melt at reasonable temperatures and still withstand
aging at the operational temperatures.
Component lead plaring/coating is also a problem as not many suppliers will
do the electrolytic Ni/PdAu. For most applications the board should be
electrolytically plated with Ni-100 to 200 microinches, Pd 10 to 20 microinches
and Au 5 to 10 microinches. This plating is then used as an etch resist when
manufacturing the board. Soldrability is good for and extended length of time
since the Pd seems to be a good barrier
Phil Hinton .
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