IPC and JEDEC have announced the Call for Participation for the 11th International Conference on Lead Free Electronic Components and Assemblies, scheduled to take place December 6-8, 2005 in Boston, MA.

Educational courses, as well as a technical conference will be held. IPC and JEDEC are seeking abstract submissions and workshops/tutorials on the following relevant subjects.

European lead ban status/policy development
                European/Chinese/other legislation or voluntary activity on hazardous materials and recycling
                Legislative compliance and policy enforcement methods
Supply chain issues
                Marking and testing standards
                Materials declarations, part numbers, obsolescence, etc.
Production issues
                Design for lead free production
                Component, solder, board developments, availability and lead free compatibility
                Examples of implementation
                Reflow, wave, hand soldering, inspection, repair, rework, test, etc
Reliability issues
                Tin whiskers
                Reliability test data and method developments
                High reliability product sectors (automotive, aerospace, etc)
Environmental considerations
                Toxicity and risk
                Recycling 
                Substitutes for other hazardous substances (Cd, Hg, Hex. Cr) 
Research consortia news and updates

Please e-mail your abstract submission or your course proposal to [log in to unmask] The deadline to submit an abstract or course proposal is September 6th. 

Your company also has an opportunity to exhibit or take advantage of sponsoring part of this important industry event. For more information on signing up for an exhibit or a sponsorship opportunity, contact Gwen Jader via e-mail at [log in to unmask]


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