TECHNET Archives

August 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Bob Metcalf <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob Metcalf <[log in to unmask]>
Date:
Tue, 23 Aug 2005 13:15:06 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (132 lines)
Henry,

I completely agree with Doug. Solder mask vendors are held to strict
requirements about what they can adjust in a formulation under SM-840. As
Doug states it is most likely a pre-clean issue or even a curing issue.

From time to time I have observed variances in some solder mask products due
to raw material variances. Every ingredient has a spec that has an allowable
range. Sometimes when a few ingredients are at the extreme end of the spec
it could influence the performance of the product. If your vendor has
confirmed the processing of the mask on the bare board was done correctly,
it may be useful for them to contact their solder mask supplier to make them
aware of the problem. They can do a raw material review traced back to the
batch that was used on your boards to confirm all raw materials were in
spec.

Regards,

Bob Metcalf
Circuit Solutions
949-709-2544

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Douglas O. Pauls
Sent: Friday, August 19, 2005 2:50 PM
To: [log in to unmask]
Subject: Re: [TN] Soldermask


Henry,
If the solder mask is qualified to IPC-SM-840, the vendor is only allowed a
very small window of formulation "fiddling" before he has to requalify as a
new mask formulation.  For what we have done so far, most high quality
masks will pass lead free as well.  I suspect that peeling solder mask has
more to do with changes in pre-mask cleanliness at the fabrication site
than in formulation changes by the mask vendors.

Doug Pauls




             Henry Rekers
             <Henry.Rekers@PWR
             M.COM>                                                     To
             Sent by: TechNet          [log in to unmask]
             <[log in to unmask]>                                          cc

                                                                   Subject
             08/19/2005 02:55          [TN] Soldermask
             PM


             Please respond to
              TechNet E-Mail
                   Forum
             <[log in to unmask]>
             ; Please respond
                    to
               Henry Rekers
             <Henry.Rekers@PWR
                  M.COM>






Has anybody out there had issues with peeling solder mask after wave
soldering lately?  It seems that some of the mask vendors are changing
their formulations for RoHS.

Henry J. Rekers B. Eng
Senior Manufacturing Engineer
Power Measurement
Tel: 1-250-652-7100  ext. 7510
Fax: 1-250-652-7107
E-Mail: < mailto:[log in to unmask]>
Website: < http://www.pwrm.com/>

drive energy performance(tm)

THIS COMMUNICATION IS INTENDED ONLY FOR THE INDIVIDUAL OR ENTITY TO WHICH
IT IS ADDRESSED. IT MAY CONTAIN PRIVILEGED, CONFIDENTIAL, ATTORNEY WORK
PRODUCT, OR TRADE SECRET INFORMATION WHICH IS EXEMPT FROM DISCLOSURE UNDER
APPLICABLE LAWS. IF YOU ARE NOT THE INTENDED RECIPIENT, OR AN EMPLOYEE OR
AGENT RESPONSIBLE FOR DELIVERING THE COMMUNICATION TO THE INTENDED
RECIPIENT, YOU ARE HEREBY NOTIFIED THAT ANY DISSEMINATION, DISTRIBUTION, OR
COPYING OF THIS COMMUNICATION IS STRICTLY PROHIBITED. IF YOU HAVE RECEIVED
THIS COMMUNICATION IN ERROR, PLEASE NOTIFY US IMMEDIATELY BY TELEPHONE AND
DELETE THE ORIGINAL COMMUNICATION (AND ALL COPIES).



---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2