The board is microwave, with 10 micron lines  which are 20 to 25 micron
thick, the only way i could get it to plate was using gold, copper  proved
to be to bumpy   way to many noduels and clumps,  the surface must be
smooth for the frequency, I also had to use very little oxide foot below
to get the  initial thin 2 micron copper to stick to the prepreg,    And
Ni was out because of  to high a frequency,  so the board was not
originaly to be golds just turned out that way,   It has  bga, smt  and
wire bond on it so I needed to be able to advise the assemblers how to try
and solder it, Im not down to the 10 micron yet ( 20 now) but will be
investigating a beter laser.   and to boot the micro vias are only 30
microns.  a fun but  tough board   good thing its only 1 inch square.
bob

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