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Subject:	Re: max thickness electroplated gold
From:	"Wenger, George M." <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:	Mon, 22 Aug 2005 23:21:29 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (57 lines)

Werner,

 

As usual you are correct.  You also have to know the solder composition
that these materials are dissolving into.  The values I quoted are for
dissolution into SnPb solder (eutectic or near eutectic 60/40) at a
temperature of approximately 210C.

 

Regards, 
George 
George M. Wenger, Andrew Corporation 
Reliability / FMA Engineer 
Base Station & Subsystems Group 
40 Technology Drive, Warren, NJ 07059 
(908) 546-4531 [log in to unmask] 
  

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Monday, August 22, 2005 11:15 PM
To: [log in to unmask]; Wenger, George M.
Subject: Re: [TN] max thickness electroplated gold

 

Hi George,
Now, of course, you need to add for which temperature these values were
measured, and add that they will vary greatly with temperature.



Werner



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