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Subject:
From:
Le Thanh Tung <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Le Thanh Tung <[log in to unmask]>
Date:
Tue, 23 Aug 2005 07:39:11 +0700
Content-Type:
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text/plain (73 lines)
BGA part is move out of pad after reflow.
Tung
----- Original Message -----
From: "Tempea, Ioan" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, August 22, 2005 7:30 PM
Subject: Re: [TN] Sifted part at BGA location


What do you mean by shifting? Does it skew (angular shift) or move linearly?

Ioan

> -----Original Message-----
> From: TechNet [SMTP:[log in to unmask]] On Behalf Of Le Thanh Tung
> Sent: Sunday, August 21, 2005 9:16 PM
> To:   [log in to unmask]
> Subject:      [TN] Sifted part at BGA location
>
> Hello everybody.
> At present, we are facing to one problem as below:
> BGA component is shifted after go through reflow machine.
> We have checked 100% mounting condition at BGA location before reflow, we
> sure the BGA is not shifed but after reflow the shifted part defect still
> happened.
> although we lost much time to investigate but the problem is still not be
> overcome.
> The detail of BGA is as below:
>     - BGA size: 15 x 15
>     - Pitch: 1 mm
>     - Ball dia.: 0.49 mm
>     - Product: RoHS PCBA
> Anyone who have this experience?
> Thanks
>
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