George: You imply in your message that the process is finished with an immersion Gold, and being completely unfamiliar with the process, I have a strong suspicion that it is even worse than you suspect, and that ALL THREE processes are electroless.... (Immmersion plating involves dissolving the substrate, and I have trouble seeing the Palladium dissolving). Anybody out there who is knowlegable enough to make definative comment?
Rudy Sedlak
RD Chemical Company
"Wenger, George M." <[log in to unmask]> wrote:
Richard,
Pd does on the surface of a board what it does in a catalytic converter
in a car (i.e., it pulls "stuff" out of the environment) so they put Au
over the Pd to protect the Pd. Electroless Pd over electroless Ni was
originally being advertised as a universal surface finish that is
solderable, wirebondable, and could be used as a contact surface.
However, I think the real question that needs to be asked is if
electroless processes are hard to control and gold is needed as a final
finish because it doesn't corrode then why would anyone use Immersion
Gold over Electroless Palladium over electroless Nickel when one could
use Immersion Gold over Electroless Nickel and only have one electroless
process to control?
Regards,
George
George M. Wenger, Andrew Corporation
Reliability / FMA Engineer
Base Station & Subsystems Group
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [log in to unmask]
-----Original Message-----
From: Stadem, Richard [mailto:[log in to unmask]]
Sent: Monday, August 22, 2005 4:19 PM
To: TechNet E-Mail Forum; Wenger, George M.
Subject: RE: [TN] Black pad
If Pd is used over the nickel, then why does one need the gold? The gold
is put on to preserve the solderability of the nickel. Does not the
palladium do the same thing? I know we would not solder to the
palladium.
From my bad experiences in the past with palladium applied as a final
termination finish to leaded SMT components, I would not want to solder
with palladium in the mix if I can help it.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Monday, August 22, 2005 3:09 PM
To: [log in to unmask]
Subject: Re: [TN] Black pad
Jason,
I don't type as fast as I think. I meant to say "without any reference
to" not "with any reference to".
Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Wenger, George M.
Sent: Monday, August 22, 2005 4:07 PM
To: [log in to unmask]
Subject: Re: [TN] Black pad
Jason,
Let me try to answer your question with any reference to "Black Pad". I
don't like to use an appearance name to describe a failure mode. The
short answer to the question can a brittle interface fracture be present
if using NiPdAu is YES.
Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jason Gregory
Sent: Monday, August 22, 2005 3:44 PM
To: [log in to unmask]
Subject: [TN] Black pad
Hello all,
after a short hiatus, I'm back.
I have a question - Can the Black Pad Defect be present if using NiPdAu?
Can the palladium prevent black pad?
Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)212-0844 cell
[log in to unmask]
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