If Pd is used over the nickel, then why does one need the gold? The gold
is put on to preserve the solderability of the nickel. Does not the
palladium do the same thing? I know we would not solder to the
palladium.
From my bad experiences in the past with palladium applied as a final
termination finish to leaded SMT components, I would not want to solder
with palladium in the mix if I can help it.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Monday, August 22, 2005 3:09 PM
To: [log in to unmask]
Subject: Re: [TN] Black pad
Jason,
I don't type as fast as I think. I meant to say "without any reference
to" not "with any reference to".
Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Wenger, George M.
Sent: Monday, August 22, 2005 4:07 PM
To: [log in to unmask]
Subject: Re: [TN] Black pad
Jason,
Let me try to answer your question with any reference to "Black Pad". I
don't like to use an appearance name to describe a failure mode. The
short answer to the question can a brittle interface fracture be present
if using NiPdAu is YES.
Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jason Gregory
Sent: Monday, August 22, 2005 3:44 PM
To: [log in to unmask]
Subject: [TN] Black pad
Hello all,
after a short hiatus, I'm back.
I have a question - Can the Black Pad Defect be present if using NiPdAu?
Can the palladium prevent black pad?
Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)212-0844 cell
[log in to unmask]
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