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August 2005

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Subject:
Re: Black pad
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Mon, 22 Aug 2005 16:09:26 -0400
Content-Type:
text/plain
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text/plain (103 lines) 
Jason,

I don't type as fast as I think.  I meant to say "without any reference to" not "with any reference to".

Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Wenger, George M.
Sent: Monday, August 22, 2005 4:07 PM
To: [log in to unmask]
Subject: Re: [TN] Black pad


Jason,

Let me try to answer your question with any reference to "Black Pad".  I don't like to use an appearance name to describe a failure mode.  The short answer to the question can a brittle interface fracture be present if using NiPdAu is YES. 



Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jason Gregory
Sent: Monday, August 22, 2005 3:44 PM
To: [log in to unmask]
Subject: [TN] Black pad


Hello all,

after a short hiatus, I'm back.

I have a question - Can the Black Pad Defect be present if using NiPdAu? Can
the palladium prevent black pad?

Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)212-0844 cell
[log in to unmask]

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