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Date: | Mon, 22 Aug 2005 09:15:37 -0500 |
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Dear Richard,
The IEC equilants are
IEC-61191-1, IEC 61191-2, IEC 61191-3, and IEC 61191-4 for the J-STD-001.
and
IEC 61190-1-1 for the J-STD-004
IEC 61190-1-2 for the J-STD-005
IEC 61190-1-3 for the J-STD-006 for the three material specifications.
The IEC equivalents for the J-STD-002 and J-STD-003 are not as clearly a one to one relationship.
We have for the board solderability IEC-61189-2 various methods, and for assembly IEC-61189-5 various methods. Then their are the IEC 60068-54 and IEC 60068-69 on use of the wetting balance. There are also some other tests beinjg proposed by Japan regarding the lead free solderability tests and to that we have added tests for whisker growth.
Best Regards,
Dieter Bergman
________________________________
From: TechNet on behalf of Richard Kraszewski
Sent: Mon 8/22/2005 8:15 AM
To: [log in to unmask]
Subject: [TN] IEC Specifications
Does anyone know the numbers for the European IEC counterparts of IPC
J-Std-001 & 002?
Rich K / KEDS
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