I second Gaby's, though there is a remote possibility that
vibration may shift the part, either at the change of tracks or the oven
belt needs maintenance and is vibrating.
        Regards,
        Ramon
	

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gabriela Bogdan
Sent: Sunday, August 21, 2005 11:30 PM
To: [log in to unmask]
Subject: Re: [TN] Sifted part at BGA location

Did you look at the registration between solder mask and pads?
Is the solder mask overlapping the pads?Gaby
----- Original Message -----
From: "Le Thanh Tung" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, August 22, 2005 4:15 AM
Subject: [TN] Sifted part at BGA location


> Hello everybody.
> At present, we are facing to one problem as below:
> BGA component is shifted after go through reflow machine.
> We have checked 100% mounting condition at BGA location before reflow,

> we sure the BGA is not shifed but after reflow the shifted part defect

> still happened.
> although we lost much time to investigate but the problem is still not

> be overcome.
> The detail of BGA is as below:
>    - BGA size: 15 x 15
>    - Pitch: 1 mm
>    - Ball dia.: 0.49 mm
>    - Product: RoHS PCBA
> Anyone who have this experience?
> Thanks
>
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