Did you look at the registration between solder mask and pads?
Is the solder mask overlapping the pads?Gaby
----- Original Message -----
From: "Le Thanh Tung" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, August 22, 2005 4:15 AM
Subject: [TN] Sifted part at BGA location


> Hello everybody.
> At present, we are facing to one problem as below:
> BGA component is shifted after go through reflow machine.
> We have checked 100% mounting condition at BGA location before reflow, we
> sure the BGA is not shifed but after reflow the shifted part defect still
> happened.
> although we lost much time to investigate but the problem is still not be
> overcome.
> The detail of BGA is as below:
>    - BGA size: 15 x 15
>    - Pitch: 1 mm
>    - Ball dia.: 0.49 mm
>    - Product: RoHS PCBA
> Anyone who have this experience?
> Thanks
>
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