Hello everybody.
At present, we are facing to one problem as below:
BGA component is shifted after go through reflow machine.
We have checked 100% mounting condition at BGA location before reflow, we
sure the BGA is not shifed but after reflow the shifted part defect still
happened.
although we lost much time to investigate but the problem is still not be
overcome.
The detail of BGA is as below:
    - BGA size: 15 x 15
    - Pitch: 1 mm
    - Ball dia.: 0.49 mm
    - Product: RoHS PCBA
Anyone who have this experience?
Thanks

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