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August 2005

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Subject:
From:
Alexandra Curtis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Alexandra Curtis <[log in to unmask]>
Date:
Fri, 19 Aug 2005 14:58:26 -0500
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Sign up today for one or all of Dr. Jennie Hwang's workshops covering every aspect of lead free. From implementation of lead free, to specific issues on the reliability of lead free solder, and the role of bismuth, find out everything you need to know to meet the requirements before the July 2006 deadline.
 
Lead Free Implementation and Production
September 12, 2005 * 8:30 - 11:30
The course will present the real-world process parameters and successful high-volume production results from companies such as Thomson, Sony, Panasonic, and Hitachi. The common Pb-free production defects and preventive steps will be discussed in comparison with SnPb.
 
Lead Free Reliability & Manufacturing
September 12, 2005 * 1:00 - 4:00
The course will discuss the system compatibility between the BGA/CSP solder sphere, assembly solder paste, component coating and PCB substrate surface finish.
 
Lead Free Compatibility - Materials & Process
September 13, 2005 * 8:30 - 11:30
Focusing on system compatibility, the interactions among the components, BGA/CSP solder spheres, assembly solder paste and PCB surface finish will be covered.
 
Lead Free & the Role of Bismuth - All You Should Know About Bismuth
September 13, 2005 * 1:00 - 4:00
This course addresses the relevant aspects on the role and effects of bismuth. 
 
These workshops will be held at IPC's headquarters, 3000 Lakeside Dr., Suite 309S, Bannockburn (Chicago), IL. For full course descriptions, pricing information and to register, please go to www.ipc.org <http://www.ipc.org/> . 
 

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