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August 2005

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Fri, 19 Aug 2005 10:44:45 -0400
Content-Type:
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text/plain (205 lines)
        Doug:
                Would air flow over the flux be an option? Air will
remove the moisture faster from the flux. No matter how wet the air is
the moisture in the flux will tend to evaporate since it is at a higher
percentage and the air will move it away.
        Regards,
        Ramon

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
Sent: Friday, August 19, 2005 9:11 AM
To: [log in to unmask]
Subject: Re: [TN] Copper Mirror test for water-based fluxes

Bev,
Since the copper mirror test is there to check for the activity level of
the flux, I would not want to increase that activity by the addition of
heat.  I would suggest pulling a low vacuum on the sample and remove the
water that way.

Doug Pauls




             Bev Christian
             <[log in to unmask]
             OM>
To
             Sent by: TechNet          [log in to unmask]
             <[log in to unmask]>
cc

 
Subject
             08/17/2005 04:21          Re: [TN] Copper Mirror test for
             PM                        water-based fluxes


             Please respond to
              TechNet E-Mail
                   Forum
             <[log in to unmask]>
             ; Please respond
                    to
               Bev Christian
             <[log in to unmask]
                    OM>






Rudy and others,

The copper mirror test is a simple look-and-see test that can be used as
part of the qualification of a flux, solder paste, or any other chemical
that may come in contact with a printed circuit board or printed circuit
pack.  See IPC-TM-650, Test Method 2.3.32D.  Essentially a flux or
material is dissolved in IPA (or at least sort of), applied to a vapour
deposited copper mirror, the solvent is allowed to evaporate and then
the mirror is stored at RT and 50%RH for 24 hours and then you wash off
the material and see whether it has eaten through the thin copper mirror
coating.



Now if you are using water as the solvent, the vapour pressure is much
lower.  I can't remember what I used to do when I did this test at
Nortel in the late 90's when we started to use the water-based wave
solder fluxes.

Bev

RIM



  _____

From: R Sedlak [mailto:[log in to unmask]]
Sent: August 17, 2005 3:41 PM
To: TechNet E-Mail Forum; Bev Christian
Subject: Re: [TN] Copper Mirror test for water-based fluxes



For those of us who only recently realized that something had to happen
to a PCB before it was installed..(Assembly?  What's that?)... be so
kind as to tell us more about this test, and what it is supposed to tell
you... and how to read it....



Any help is appreciated...(and needed)



Rudy Sedlak

RD Chemical Company

Bev Christian <[log in to unmask]> wrote:

        It is such a long time that I have done one of these, that I
don't
        remember what we did to evaporate the water! The alcohol based
ones are
        easy, but the water ones?! Do you just let them set at room
temperature
        or do you give them a little heat or what?
        Bev
        RIM





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