TECHNET Archives

August 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Happy Holden <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 18 Aug 2005 13:31:39 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (91 lines)
The famous Silicon Valley RLM process was selective solder over
tin/nickel.  We perfected the tin/nickel at H-P's Porter Dr. PCB facility
in 1967 and used it as a final finish for many years.  It is almost
straight out of the "Metal Finishing Handbook" as the 'chloride/fluoride'
bath with pure tin anodes.  When I joined them in 1969, I started to use a
Gold Flash or a Bright Tin Flash over the tin/nickel because it was so
hard to solder to after the protective oxide had formed on its surface.
But it is a remarkable alloy with properties far better than nickel or
tin.  IF YOU COULD CONTROL THE STRESS!
Happy Holden
APM



Steve Hodge <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
08/17/2005 04:31 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Steve Hodge <[log in to unmask]>


To
[log in to unmask]
cc

Subject
 HASL over nickel






I believe the process for the selective solder over nickel (RLM) used
tin/nickel and not pure sulfamate nickel. In the case I cited, we had to
put on the immersion gold to prevent passivation in between nickel and
HASL
processes.

At 02:12 PM 08/17/2005, you wrote:
>Which works for a plating process, not too sure if the same applies where
>the nickel is happily oxidizing all of the time it is out of a plating
tank.
>
>John
>
>------------------------------------
>Avanex
>John Burke
>Senior Manager RoHS Compliance
>[log in to unmask]
>40919 Encyclopedia Circle
>Fremont
>CA 94538
>tel: 510 897 4250
>fax: 510 979 0189
>mobile: 510 676 6312
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of Scott B. Westheimer
>Sent: Wednesday, August 17, 2005 1:01 PM
>To: [log in to unmask]
>Subject: Re: [TN] HASL over nickel
>
>
>The was actually a process back in the 70's called RLM. For you that
worked
>in Silicon Valley back then it stood for Robert L Mac the owner of Santa
>Clara Circuits who had the process patented. It was a nickel plated board
>that was then covered completed with screen ink, sorry no dry film back
>then, except for the pads and then tin leaded plated and reflowed. Was
there
>any issues? Not sure but there was a lot of boards made that way, for
>several years.
>
>Scott B. Westheimer
>Colonial Circuits




---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2