The word "filled" adds some further questions. If that is in reference to
the laminate resin having filler additives they do provide less
expansion and can help with PTH reliability. However, the "filler" does come
with a cost. This may greatly help with survivability on high
aspect ratio thick PCBs but it may also be unnecessary costs on low layer
count PCBs. There really should be no "silver bullet"
material. The best "high rel" materials come with a serious cost multiplier
and should only be used on those "big, thick, and ugly"
PCBs that really need them (or high temp environments where excessive
thermal cycles may be used). For the lower layer count
PCBs there should be a whole host of non-DICY materials that should take
care of their LF needs. If the PCB is thin enough and the
LF assembly temp is low enough, even DICY materials will survive.

Cheers,

David Hoover  (aka, Groovy)

----- Original Message -----
From: "Tempea, Ioan" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, August 18, 2005 7:50 AM
Subject: Re: [TN] New Resin System


Joe,

a few months ago I had a chat with Dick Woolley of Tyco's PCB division. He
recomended the phenolic filled resin systems as being a must requirement for
a PCB supposed to be ready for  lead-free. Although the verbage is slightly
different, something tells me we are talking about the same thing.

Maybe he wouldn't mind if you contact him, [log in to unmask]

Regards,
Ioan

> -----Original Message-----
> From: TechNet [SMTP:[log in to unmask]] On Behalf Of Kane, Joseph E (US SSA)
> Sent: Thursday, August 18, 2005 10:27 AM
> To:   [log in to unmask]
> Subject:      [TN] New Resin System
>
> New Phenolic cured epoxy resin systems are being qualified to
> IPC-4101/24, 26, and 98 requirements.
> Has anyone tested these new materials?  How do you know which material
> you are really getting
> (new Phenolic or old DICY cured epoxy resins)?
>
> Joe Kane
> BAE SYSTEMS
> Johnson City, NY
>
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