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August 2005

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Subject:
From:
"Stadem, Richard" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard
Date:
Mon, 1 Aug 2005 07:41:50 -0500
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text/plain (72 lines)
Should one have to? I would think that was a given. Perhaps we should
put that on the DFM checklist as well. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Edwin Louis
Sent: Monday, August 01, 2005 7:38 AM
To: [log in to unmask]
Subject: Re: [TN] RoHs board surface recommendations.

Ask the plater for black pad free ENIG.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of George Milad
Sent: Friday, July 29, 2005 7:14 AM
To: [log in to unmask]
Subject: Re: [TN] RoHs board surface recommendations.

Do not discount ENIG.
There is data available now showing that soldering to the Ni surface at
the SAC alloy temperature conditions produces a very robust solder
joint.
There are Ni baths available now that are RoHS compliant i.e. no Cd and
no PB.

Best  regards

George Milad
[log in to unmask]
National Accounts Manager  for Technology Uyemura International
Corporation Technical Center 240  Town LIne Rd Southington CT 06489
(516) 901 3874 (mobile)
(860)  793-4011 (office)
(860) 793-4020 (fax)

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