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August 2005

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Wed, 17 Aug 2005 17:21:38 -0400
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Rudy and others, 

The copper mirror test is a simple look-and-see test that can be used as
part of the qualification of a flux, solder paste, or any other chemical
that may come in contact with a printed circuit board or printed circuit
pack.  See IPC-TM-650, Test Method 2.3.32D.  Essentially a flux or
material is dissolved in IPA (or at least sort of), applied to a vapour
deposited copper mirror, the solvent is allowed to evaporate and then
the mirror is stored at RT and 50%RH for 24 hours and then you wash off
the material and see whether it has eaten through the thin copper mirror
coating.

 

Now if you are using water as the solvent, the vapour pressure is much
lower.  I can't remember what I used to do when I did this test at
Nortel in the late 90's when we started to use the water-based wave
solder fluxes.

Bev

RIM

 

  _____  

From: R Sedlak [mailto:[log in to unmask]] 
Sent: August 17, 2005 3:41 PM
To: TechNet E-Mail Forum; Bev Christian
Subject: Re: [TN] Copper Mirror test for water-based fluxes

 

For those of us who only recently realized that something had to happen
to a PCB before it was installed..(Assembly?  What's that?)... be so
kind as to tell us more about this test, and what it is supposed to tell
you... and how to read it....

 

Any help is appreciated...(and needed)

 

Rudy Sedlak

RD Chemical Company

Bev Christian <[log in to unmask]> wrote:

        It is such a long time that I have done one of these, that I
don't
        remember what we did to evaporate the water! The alcohol based
ones are
        easy, but the water ones?! Do you just let them set at room
temperature
        or do you give them a little heat or what?
        Bev
        RIM
	
	
	
	
	
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