We are remanufacturing (reworking some of product) due to an ECR release.  We apply a label with non-conductive adhesive that once removed leaves adhesive on the PCBA. This adhesive prevents the board from passing due to not making contact.  The current process requires an operator to use IPA and a soft scrub to remove it. This process is time consuming.  My CM has suggested that we ultrasonic the boards using S-10 solvent. 

 

My boards have BGAs, interconnect pins, and switches along with the normal SMT parts.  Will using this s-10 solvent in an ultrasonic cleaner work, and will it not cause any reliability issues with BGAs or other parts on the boards? 

 

Anyone have any other suggestions for auto cleaning my boards to remove the adhesive.  We use the no clean process. 
 

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