question: if it is high speed board, does the additional nickel layer have a
performance impact?  (assume it is properly done 200-300 micro inch stuff or
Ni-P electroless stuff for 20-30 micro inches...2 different cases...).
                          jk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Hodge
Sent: Wednesday, August 17, 2005 3:59 PM
To: [log in to unmask]
Subject: Re: [TN] <List>[TN] HASL over nickel


Tom, HASL over ENIG is okay. We used to have a customer who spec'd it.
Actually they spec'd HASL over Nickel but the passivation rate of nickel is
so quick that we ended up using immersion au for protection.


At 01:38 PM 08/17/2005, you wrote:
>Our PC board supplier inadvertently supplied us with boards composed of
>gold over nickel rather than the specified HASL finish. While we kept some
>of the boards to keep our production line running, we sent the rest back to
>have the gold stripped off and run through the HASl process. Now our
>supplier is telling us that they will not be able to remove the nickel that
>has bonded to the copper pads. I'm going to have the supplier guarantee the
>board life in blood, but I would feel more confident in having confirmation
>by this group's expertise. Thanks for your help.
>
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