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August 2005

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Subject:
From:
Bob Metcalf <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob Metcalf <[log in to unmask]>
Date:
Tue, 16 Aug 2005 14:07:27 -0700
Content-Type:
text/plain
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text/plain (88 lines)
Mumtaz,

I agree with Steve. I assume from the pictures that this is the way you
received the boards from your vendor. This is an unacceptable condition and
should be returned for rework or remake. The cause is most likely surface
prep prior to mask application or could be related to under cure of the
mask.

Regards,

Bob Metcalf
Circuit Solutions
949-709-2544

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Hodge
Sent: Tuesday, August 16, 2005 12:12 PM
To: [log in to unmask]
Subject: Re: [TN] <List>[TN] Exposed Copper on PWB- Rejectable


Mumtaz, solder mask adhesion caused by poor precleaning prior to masking
operation. The problem will worsen after a thermal excursion. No way would
I assemble the boards-get an RMA. Just my humble opinion. Good luck, Steve.

At 01:12 PM 08/16/2005, you wrote:
>Dear All,
>
>
>I need a second opinion on the rejection of this exposed copper to resolve
>a line issue for IPC Class 2 . The defect images are posted on Steven
>Gregory's website. Please go to page 2  and look for exposed Copper 1 and
>Exposed copper 2.  Thank-you Steven for the posting.Go
>to:http://www.stevezeva.homestead.com
>
>Thank-you
>
>Mumtaz
>
>  D/ 252 - SMT Process and Component Quality
>  Bldg. V238E
>Voice  (858)-882-1967
>Fax    (858)-882-3126
>Page  (858)-635-1180
>Cell:   (858) -449-7054
>email: [log in to unmask]
>Kyocera-Wireless Corp.
>10300, Campus Point Drive
>
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