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Subject:	Re: <List>[TN] Exposed Copper on PWB- Rejectable
From:	Steve Hodge <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Steve Hodge <[log in to unmask]>
Date:	Tue, 16 Aug 2005 13:11:41 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (53 lines)

Mumtaz, solder mask adhesion caused by poor precleaning prior to masking
operation. The problem will worsen after a thermal excursion. No way would
I assemble the boards-get an RMA. Just my humble opinion. Good luck, Steve.

At 01:12 PM 08/16/2005, you wrote:
>Dear All,
>
>
>I need a second opinion on the rejection of this exposed copper to resolve
>a line issue for IPC Class 2 . The defect images are posted on Steven
>Gregory's website. Please go to page 2  and look for exposed Copper 1 and
>Exposed copper 2.  Thank-you Steven for the posting.Go
>to:http://www.stevezeva.homestead.com
>
>Thank-you
>
>Mumtaz
>
>  D/ 252 - SMT Process and Component Quality
>  Bldg. V238E
>Voice  (858)-882-1967
>Fax    (858)-882-3126
>Page  (858)-635-1180
>Cell:   (858) -449-7054
>email: [log in to unmask]
>Kyocera-Wireless Corp.
>10300, Campus Point Drive
>
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