I too would like that documentation. And I would ask the question "are all
of Uyemura customers notified of this possible elimination and therefore
abide by the 2 to 4"?
James

----- Original Message -----
From: "Stadem, Richard" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, August 15, 2005 8:57 AM
Subject: Re: [TN] osp vs ENIG


Thanks, George. This is good information. Can you provide documentation
or data regarding the 2-4 uins of gold killing the BP problem?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of George Milad
Sent: Monday, August 15, 2005 8:39 AM
To: [log in to unmask]
Subject: Re: [TN] osp vs ENIG

ENIG is the number one choice for a contacting surface.
At the IPC Plating Committee round robin testing with ENIG as a contact
surface indicated >1000,000 actuations without any change in
resistivity.

With good process control ENIG is free of "Black Pad" issues. The new
IPC ENIG specifications 4553, that specifies less immersion gold (2-4
uins) has virtually eliminated BP.

Do we stop using electroless copper because of occasional voiding, or
inner layer separation?

Do we stop using electrolytic copper because we occasionally have copper
cracks?

Do we stop etching because of oevr hang and undercut?

PCB manufacturing is all about "PROCESS CONTROL"
ENIG is no different.

I agree that Immersion Silver has a lot of potential as a finish  also.

Best  regards

George Milad
[log in to unmask]
National Accounts Manager  for Technology Uyemura International
Corporation Technical Center 240  Town LIne Rd Southington CT 06489
(516) 901 3874 (mobile)
(860)  793-4011 (office)
(860) 793-4020 (fax)

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