Bob,
what is this best practice process control? We are a user of ENIG, very few issues, but maybe we could go down to no issue.
Thanks,
Ioan
> -----Original Message-----
> From: TechNet [SMTP:[log in to unmask]] On Behalf Of Bob Metcalf
> Sent: Monday, August 15, 2005 1:47 PM
> To: [log in to unmask]
> Subject: Re: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface recommendations.
>
> As the former Global Final Finishes Business Manager for Rohm&Haas (formerly
> Shipley), I can tell you process control is everything using ENIG. I was
> responsible for ENIG, as well as other finishes. I was also around during
> the time when there was litigation involving ENIG field failures. We
> established a program insisting our customers employ "best practice" process
> control or we would not sell them the product. We went from several failures
> every month to almost zero. After insuring our customers process was in
> control and then setting up a program that insured it stayed that way.
>
> There are several choices for final finishes and ENIG has it's place and I
> believe will continue to. Is it the best finish for all
> applications......no. As you can see from the responses, there are many fans
> of silver and silver and I believe it is a great finish for many
> applications.
>
> Bob Metcalf
> Circuit Solutions
> 949-709-2544
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Hodge
> Sent: Thursday, August 11, 2005 11:37 AM
> To: [log in to unmask]
> Subject: Re: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface
> recommendations.
>
>
> Yes Richard, you are right on with the process control part. Every process
> has to be controlled. The BGA and blackpad thing. I do not understand the
> correllation. I have many thousands of heavily populated BGA designs out
> there in serviceland--no black pad problem--ever --in house or at the
> customer. It is not just luck either. LOL
>
>
> At 12:22 PM 08/11/2005, you wrote:
> >Steve and John,
> >I think it is safe to say that ENIG is a good finish, but it
> >depends......(sorry, Doug).
> >It depends on the fab house or plater, how well they control the plating
> >process to prevent the issues. It also depends on the type of assembly
> >and its use. However, it is such a difficult process to control that it
> >is hard to say when the issues will appear. But eventually they probably
> >will, for any user, from any vendor. It is still very much a viable
> >option for those who are afraid of potential problems with immersion
> >silver or any other surface finish.
> >But on the other hand I myself hesitate to re-qualify something if it
> >isn't broken. If you have an assembly with ENIG, and you get it from a
> >board vendor who seems to be able to do it consistently without
> >problems, it would certainly not be wise to change.
> >I just know that I would not recommend ENIG for an assembly populated
> >with BGA's. Especially if the assembly is going to see a service life
> >exposed to high thermal cycling. This is where the dreaded Black Pad
> >problem seems to thrive.
> >I know that the aerospace industry has not accepted immersion silver,
> >but it is only a matter of time.
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Hodge
> >Sent: Thursday, August 11, 2005 12:44 PM
> >To: [log in to unmask]
> >Subject: Re: [TN] <Misc>Re: [TN] RoHs board surface recommendations.
> >
> >John, come on now. Anything can happen at any time. I have seen some
> >reservations from the IS users as to silver migration possibilities and
> >shelf life/handling issues --you might say they have not seen them
> >--"yet".
> >I have had more problems with HASL, OSP and IT than I have with ENIG.
> >ENIG has longer data history than IS, so both shoes have already dropped
> >so to speak. Three years without problems, is an eternity in this>
> >business, especially when we are expected to build custom products in
> >24 hours.
> >
> >
> >At 11:00 AM 08/11/2005, you wrote:
> > >with it............YET..........
> > >
> > >------------------------------------
> > >Avanex
> > >John Burke
> > >Senior Manager RoHS Compliance
> > >[log in to unmask]
> > >40919 Encyclopedia Circle
> > >Fremont
> > >CA 94538
> > >tel: 510 897 4250
> > >fax: 510 979 0189
> > >mobile: 510 676 6312
> > >------------------------------------
> > >
> > >
> > >-----Original Message-----
> > >From: TechNet [mailto:[log in to unmask]]On Behalf Of Edwin Louis
> > >Sent: Thursday, August 11, 2005 4:48 AM
> > >To: [log in to unmask]
> > >Subject: Re: [TN] RoHs board surface recommendations.
> > >
> > >
> > >We have been using ENIG now for about three years and have had no bad
> > >experiences with it. NASA for one does not allow the use of silver .
> > >
> > >-----Original Message-----
> > >From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
> > >Sent: Wednesday, August 10, 2005 4:57 PM
> > >To: [log in to unmask]
> > >Subject: Re: [TN] RoHs board surface recommendations.
> > >
> > >Hi Steve,
> > >I do not know about "bad-mouth ENIG"--I am a reliability consultant,
> > >and have had plenty of calls because of ENIG related failures, but not
> > >a one about iAg. On the other hand, I do not know about their
> > >respective environmental implications.
> > >
> > >Regards,
> > >Werner Engelmaier
> > >Engelmaier Associates, L.C.
> > >Electronic Packaging, Interconnection and Reliability Consulting
> > >7 Jasmine Run
> > >Ormond Beach, FL 32174 USA
> > >Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
> > >E-mail: [log in to unmask], Website: www.engelmaier.com
> > >
> > >
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