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August 2005

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Subject:
From:
Steve Hodge <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Hodge <[log in to unmask]>
Date:
Mon, 15 Aug 2005 08:03:59 -0600
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Thank you George! Our company had to stop processing OSP due to expense.
OSP is okay if you run alot of it. But, when the bath sets for days at a
time, the chemicals degrade. Replenishment/shelflife issues made it
prohibitively expensive.

At 07:39 AM 08/15/2005, you wrote:
>ENIG is the number one choice for a contacting surface.
>At the IPC Plating Committee round robin testing with ENIG as a contact
>surface indicated >1000,000 actuations without any change in  resistivity.
>
>With good process control ENIG is free of "Black Pad" issues. The new IPC
>ENIG specifications 4553, that specifies less immersion gold (2-4 uins) has
>virtually eliminated BP.
>
>Do we stop using electroless copper because of occasional voiding, or inner
>layer separation?
>
>Do we stop using electrolytic copper because we occasionally have copper
>cracks?
>
>Do we stop etching because of oevr hang and undercut?
>
>PCB manufacturing is all about "PROCESS CONTROL"
>ENIG is no different.
>
>I agree that Immersion Silver has a lot of potential as a finish  also.
>
>Best  regards
>
>George Milad
>[log in to unmask]
>National Accounts Manager  for Technology
>Uyemura International Corporation
>Technical Center
>240  Town LIne Rd
>Southington CT 06489
>(516) 901 3874 (mobile)
>(860)  793-4011 (office)
>(860) 793-4020 (fax)
>
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