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August 2005

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Tue, 2 Aug 2005 16:24:36 -0400
Content-Type:
text/plain
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text/plain (73 lines)
For .002" annular ring for 360 about the pad we look for .018" over the
drill size - both internal and external.  We have taken a few jobs in at
.016", but board size, layer count, dielectric thickness/base materials
and design geometry have an impact true position tolerance.

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 
-----Original Message-----
From: Hal Winslow [mailto:[log in to unmask]] 
Sent: Tuesday, August 02, 2005 3:03 PM
To: [log in to unmask]
Subject: [TN] Required capture pad size for drilled holes?

I'm looking for what fab houses would consider to be the minimum sized
capture pad for a drilled hole in a PCB if acceptability is specified
per IPC 600 Class 3.  

 

For instance, when specifying a .010 via (+0, -.010 finished hole size)
what size pad should I design in so that you can hit the minimum .002
annular ring required for Class 3?

 

I believe that I have heard drill size plus .014 for the pad size.

 

Bonus points will be awarded if there is a difference between inner and
outer layer pad size and you detail that for me...

 

Thanks!

Hal Winslow


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