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Date: | Tue, 2 Aug 2005 16:24:36 -0400 |
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For .002" annular ring for 360 about the pad we look for .018" over the
drill size - both internal and external. We have taken a few jobs in at
.016", but board size, layer count, dielectric thickness/base materials
and design geometry have an impact true position tolerance.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice: 802.257.4571.21 Fax: 802.257.0011
http://www.vtcircuits.com
-----Original Message-----
From: Hal Winslow [mailto:[log in to unmask]]
Sent: Tuesday, August 02, 2005 3:03 PM
To: [log in to unmask]
Subject: [TN] Required capture pad size for drilled holes?
I'm looking for what fab houses would consider to be the minimum sized
capture pad for a drilled hole in a PCB if acceptability is specified
per IPC 600 Class 3.
For instance, when specifying a .010 via (+0, -.010 finished hole size)
what size pad should I design in so that you can hit the minimum .002
annular ring required for Class 3?
I believe that I have heard drill size plus .014 for the pad size.
Bonus points will be awarded if there is a difference between inner and
outer layer pad size and you detail that for me...
Thanks!
Hal Winslow
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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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