ENIG is the number one choice for a contacting surface.
At the IPC Plating Committee round robin testing with ENIG as a contact
surface indicated >1000,000 actuations without any change in  resistivity.

With good process control ENIG is free of "Black Pad" issues. The new IPC
ENIG specifications 4553, that specifies less immersion gold (2-4 uins) has
virtually eliminated BP.

Do we stop using electroless copper because of occasional voiding, or inner
layer separation?

Do we stop using electrolytic copper because we occasionally have copper
cracks?

Do we stop etching because of oevr hang and undercut?

PCB manufacturing is all about "PROCESS CONTROL"
ENIG is no different.

I agree that Immersion Silver has a lot of potential as a finish  also.

Best  regards

George Milad
[log in to unmask]
National Accounts Manager  for Technology
Uyemura International Corporation
Technical Center
240  Town LIne Rd
Southington CT 06489
(516) 901 3874 (mobile)
(860)  793-4011 (office)
(860) 793-4020 (fax)

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