Hi Chris,
ENIG = Electroless Nickel Immersion Gold
Best Regards,
Joe Russeau
Process Analyst
Precision Analytical Laboratory, Inc.
4106 Cartwright Dr. Ste. A
Kokomo, IN 46902
P: 765-455-1993
F: 765-455-1996
E: [log in to unmask]
----- Original Message -----
From: "Schaefer, Chris" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, August 12, 2005 2:41 PM
Subject: Re: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface
recommendations.
> What does ENIG stand for? Emersion Nickel over Gold???
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Ellsworth Berkowitz
> Sent: Friday, August 12, 2005 11:02 AM
> To: [log in to unmask]
> Subject: Re: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface
> recommendations.
>
>
> In the early '97 timeframe we switched from HASL to ENIG, primarily to
> achieve "flat pads" for the increasing use of fine pitch & BGAs in our
> designs. Within several months of ENIG implementation, however, we
> experienced the "black pad" phenomenon. We went into scramble mode to
find
> an alternative...
>
> After attending the IPC Surface Finishes conference that year, we selected
> OSP as our first choice finish. Immersion Ag looked very promising but we
> didn't believe it was as widely available; we did continue to monitor
> developments with this finish.
>
> OSP has worked very well in our process over these years. We started to
> migrate to immersion Ag in the past year, however, mostly due to issues
with
> ICT probing of OSP test point pads. As the complexity of our products has
> increased, the designs have likewise migrated from reflow-wave to
> double-sided reflow & selective solder. Wave solder more effectively
> prepares the OSP test point for probing; solder paste & reflow presents
more
> challenge to consistently cover our typical via-in-pad test points. A
whole
> 'nother story...
>
> Generally we have reasonable inventory turnover, so OSP aging &
degradation
> over time hasn't been a problem (in a few cases of slow moving product, we
> sent boards out to be re-OSP'ed). We have linked lines, so, when a work
> order starts it stays on the line until all assembly & soldering is
finished
> (the chance for external Cu to oxidize after exposure to multiple thermal
> processes is therefore very limited; our boards don't wait in lengthy
> queue's after reflow or glue cure). Also, we don't bake boards.
>
> Solder joint integrity is excellent with OSP.
>
> We still specify OSP on low complexity designs (very few of those
anymore...).
>
> Immersion Ag is working well; also, cost has been on par with OSP (our
buyer
> does a great job working with the suppliers).
>
> Hope this helps. Contact me off-line if you have other questions.
>
> Ellsworth D. Berkowitz, P.E.
>
> On Thu, 11 Aug 2005 14:49:08 -0600, Cheryl Johnson
> <[log in to unmask]> wrote:
>
> >Well I am a wife, don't have a tail (hair down to my waist, though...)
> >In any case, I have been using ENIG for several years with no problems.
> >
> >HOWEVER, recently our off shore fab house is wanting us to go to "OSP
over
> >copper".
> >
> >Any comments? Thank you!
> >
> >Sincerely,
> >-----------------------------------
> >Cheryl Johnson, C.I.D.+
> >Manager
> >ExcelStor US Office, Engineering Services
> >Email: [log in to unmask]
> >Tel: (303) 684-7291
> >Fax: (303) 684-7268
> >Mobile: (303) 809-5815
> >-----------------------------------
> >
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]]On Behalf Of John Burke
> >Sent: Thursday, August 11, 2005 1:16 PM
> >To: [log in to unmask]
> >Subject: Re: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface
> >recommendations.
> >
> >
> >Yup.......................
> >
> >Lets change the chemistry topic...............Ice cream anyone??
> >
> >John
> >
> >------------------------------------
> >Avanex
> >John Burke
> >Senior Manager RoHS Compliance
> >[log in to unmask]
> >40919 Encyclopedia Circle
> >Fremont
> >CA 94538
> >tel: 510 897 4250
> >fax: 510 979 0189
> >mobile: 510 676 6312
> >------------------------------------
> >
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard
> >Sent: Thursday, August 11, 2005 1:09 PM
> >To: [log in to unmask]
> >Subject: Re: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface
> >recommendations.
> >
> >
> >It must be Friday for some of us:)
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Ball
> >Sent: Thursday, August 11, 2005 2:48 PM
> >To: [log in to unmask]
> >Subject: Re: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface
> >recommendations.
> >
> >......unnnnh........no tail.......wife..........must
> >resist.........arrrrgh....
> >
> >
> >
> >
> > Steve Hodge
> > <[log in to unmask]> To:
> >[log in to unmask]
> > Sent by: TechNet cc:
> > <[log in to unmask]> Subject: Re:
> >[TN] <Misc>Re: [TN]
> > <Misc>Re:
> >[TN] RoHs board surface
> > 08/11/2005 03:36 PM
> >recommendations.
> > Please respond to TechNet
> > E-Mail Forum; Please
> > respond to Steve Hodge
> >
> >
> >
> >
> >
> >
> >
> >George, I am sorry you feel you have to downgrade my opinion as being a
> >sales pitch or "wife's tail". I am stating data -substantiated facts and
> >I could care less about selling something to you or anyone else. A
> >wife's tail? What? My wife does not have a tail. I think it should be
> >"wive's tale" anyway.
> >
> >At 12:30 PM 08/11/2005, you wrote:
> >>John,
> >>
> >>Your opinionated! but then too so am I. However, it sounds like our
> >>opinions are based on data and not "wife's tails" or "sales pitches"
> >>
> >>Regards,
> >>George
> >>George M. Wenger
> >>Reliability / FMA Engineer
> >>Base Station and Subsystems Group
> >>Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908)
> >>546-4531 [log in to unmask]
> >>
> >>
> >>-----Original Message-----
> >>From: TechNet [mailto:[log in to unmask]]On Behalf Of John Burke
> >>Sent: Thursday, August 11, 2005 2:16 PM
> >>To: [log in to unmask]
> >>Subject: Re: [TN] <Misc>Re: [TN] RoHs board surface recommendations.
> >>
> >>
> >>Very nice,
> >>
> >>Until you consider that ENIG infringes the design rules for at least
> >>one
> >of
> >>the top 3 global CM's due to the issues associated with it.
> >>
> >>If you want the number of their chief technologist who has to look at
> >enigma
> >>failures week in week out I will happily supply details off line.
> >>
> >>I personally have built hundreds of thousands of assemblies on ENIG as
> >well
> >>as Immersion AG.
> >>
> >>As for the rest, HASL is generally failure related to a complete lack
> >>of understanding of tin thickness and intermetallic growth rate, OSP
> >>failures generally are related to not understanding the degradation of
> >>that finish with multiple reflow cycling, and personally I would never
> >>use immersion
> >tin
> >>without some type of diffusion barrier between it and the copper if nay
> >time
> >>in storage was to be considered.
> >>
> >>The ENIG when it fails can be catastrophic............and in most cases
> >can
> >>be pointed back to the process at the fab house rather than what
> >>happened
> >to
> >>it during the assembly process, unlike most of the other finish
> >>defects,
> >and
> >>has to my knowledge resulted in multi million dollar lawsuits between
> >>companies in the bay area due to failures.
> >>
> >>If it doesn't fail - it is fine, but the joint shear strength is less
> >>than the equivalent HASL or immersion AG finish due to the Tin
> >>nickel/nickel copper crystalline structure, so taking into
> >>consideration the higher temperatures of lead free I would be vary
> >>careful using it for area array packages using this soldering
> >technology.
> >>
> >>For the record have been using immersion silver since 1996 as I
> >>produced
> >the
> >>first beta site production runs using alpha level, so perhaps my views
> >have
> >>a little more history.
> >>
> >>Call me opinionated - I'll take it.
> >>
> >>John
> >>
> >>
> >>
> >>
> >>
> >>
> >>
> >>------------------------------------
> >>Avanex
> >>John Burke
> >>Senior Manager RoHS Compliance
> >>[log in to unmask]
> >>40919 Encyclopedia Circle
> >>Fremont
> >>CA 94538
> >>tel: 510 897 4250
> >>fax: 510 979 0189
> >>mobile: 510 676 6312
> >>------------------------------------
> >>
> >>
> >>-----Original Message-----
> >>From: Steve Hodge [mailto:[log in to unmask]]
> >>Sent: Thursday, August 11, 2005 10:44 AM
> >>To: TechNet E-Mail Forum; John Burke
> >>Subject: Re: <Misc>Re: [TN] RoHs board surface recommendations.
> >>
> >>
> >>John, come on now. Anything can happen at any time. I have seen some
> >>reservations from the IS users as to silver migration possibilities and
> >
> >>shelf life/handling issues --you might say they have not seen them
> >--"yet".
> >>I have had more problems with HASL, OSP and IT than I have with ENIG.
> >>ENIG has longer data history than IS, so both shoes have already
> >>dropped so to speak. Three years without problems, is an eternity in
> >>this business, especially when we are expected to build custom
> >products in 24 hours.
> >>
> >>
> >>At 11:00 AM 08/11/2005, you wrote:
> >> >with it............YET..........
> >> >
> >> >------------------------------------
> >> >Avanex
> >> >John Burke
> >> >Senior Manager RoHS Compliance
> >> >[log in to unmask]
> >> >40919 Encyclopedia Circle
> >> >Fremont
> >> >CA 94538
> >> >tel: 510 897 4250
> >> >fax: 510 979 0189
> >> >mobile: 510 676 6312
> >> >------------------------------------
> >> >
> >> >
> >> >-----Original Message-----
> >> >From: TechNet [mailto:[log in to unmask]]On Behalf Of Edwin Louis
> >> >Sent: Thursday, August 11, 2005 4:48 AM
> >> >To: [log in to unmask]
> >> >Subject: Re: [TN] RoHs board surface recommendations.
> >> >
> >> >
> >> >We have been using ENIG now for about three years and have had no bad
> >
> >> >experiences with it. NASA for one does not allow the use of silver .
> >> >
> >> >-----Original Message-----
> >> >From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
> >> >Sent: Wednesday, August 10, 2005 4:57 PM
> >> >To: [log in to unmask]
> >> >Subject: Re: [TN] RoHs board surface recommendations.
> >> >
> >> >Hi Steve,
> >> >I do not know about "bad-mouth ENIG"--I am a reliability consultant,
> >> >and have had plenty of calls because of ENIG related failures, but
> >> >not a one
> >about
> >> >iAg. On the other hand, I do not know about their respective
> >environmental
> >> >implications.
> >> >
> >> >Regards,
> >> >Werner Engelmaier
> >> >Engelmaier Associates, L.C.
> >> >Electronic Packaging, Interconnection and Reliability Consulting
> >> >7 Jasmine Run
> >> >Ormond Beach, FL 32174 USA
> >> >Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
> >> >E-mail: [log in to unmask], Website: www.engelmaier.com
> >> >
> >> >
> >> >---------------------------------------------------
> >> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
> >
> >> >unsubscribe, send a message to [log in to unmask] with following text
> >in
> >> >the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt
> >
> >> >or (re-start) delivery of Technet send e-mail to
> >> >[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
> >
> >> >per day of all the posts: send e-mail to
> >> >[log in to unmask]: SET Technet Digest
> >> >Search the archives of previous posts at:
> >http://listserv.ipc.org/archives
> >> >Please visit IPC web site
> >http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> >> >for additional information, or contact Keach Sasamori at
> >> >[log in to unmask]
> >or
> >> >847-615-7100 ext.2815
> >> >-----------------------------------------------------
> >> >
> >> >---------------------------------------------------
> >> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
> >
> >> >unsubscribe, send a message to [log in to unmask] with following text
> >in
> >> >the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt
> >
> >> >or (re-start) delivery of Technet send e-mail to
> >> >[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
> >
> >> >per day of all the posts: send e-mail to
> >> >[log in to unmask]: SET Technet Digest
> >> >Search the archives of previous posts at:
> >http://listserv.ipc.org/archives
> >> >Please visit IPC web site
> >http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> >> >for additional information, or contact Keach Sasamori at
> >> >[log in to unmask]
> >or
> >> >847-615-7100 ext.2815
> >> >-----------------------------------------------------
> >> >
> >> >---------------------------------------------------
> >> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
> >
> >> >unsubscribe, send a message to [log in to unmask] with following text
> >in
> >> >the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt
> >
> >> >or (re-start) delivery of Technet send e-mail to
> >> >[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
> >
> >> >per day of all the posts: send e-mail to
> >> >[log in to unmask]: SET Technet Digest
> >> >Search the archives of previous posts at:
> >http://listserv.ipc.org/archives
> >> >Please visit IPC web site
> >http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> >> >for additional information, or contact Keach Sasamori at
> >> >[log in to unmask]
> >or
> >> >847-615-7100 ext.2815
> >> >-----------------------------------------------------
> >>
> >>
> >>---------------------------------------------------
> >>Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
> >>unsubscribe, send a message to [log in to unmask] with following text in
> >>the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt
> >>or (re-start) delivery of Technet send e-mail to
> >>[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
> >>per day of all the posts: send e-mail to
> >>[log in to unmask]: SET Technet Digest
> >>Search the archives of previous posts at:
> >>http://listserv.ipc.org/archives Please visit IPC web site
> >>http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> >>for additional information, or contact Keach Sasamori at [log in to unmask]
> >
> >>or 847-615-7100 ext.2815
> >>-----------------------------------------------------
> >>
> >>-----------------------------------------------------------------------
> >>-------------------------
> >
> >>This message is for the designated recipient only and may contain
> >>privileged, proprietary, or otherwise private information.
> >>If you have received it in error, please notify the sender immediately
> >>and delete the original. Any unauthorized use of this email is
> >>prohibited.
> >>-----------------------------------------------------------------------
> >>-------------------------
> >
> >>[mf2]
> >>
> >>---------------------------------------------------
> >>Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
> >>unsubscribe, send a message to [log in to unmask] with following text in
> >>the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt
> >>or (re-start) delivery of Technet send e-mail to
> >>[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
> >>per day of all the posts: send e-mail to
> >>[log in to unmask]: SET Technet Digest
> >>Search the archives of previous posts at:
> >>http://listserv.ipc.org/archives Please visit IPC web site
> >>http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> >>for additional information, or contact Keach Sasamori at [log in to unmask]
> >
> >>or 847-615-7100 ext.2815
> >>-----------------------------------------------------
> >
> >---------------------------------------------------
> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
> >unsubscribe, send a message to [log in to unmask] with following text in
> >the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
> >(re-start) delivery of Technet send e-mail to
> >[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
> >per day of all the posts: send e-mail to
> >[log in to unmask]: SET Technet Digest
> >Search the archives of previous posts at:
> >http://listserv.ipc.org/archives Please visit IPC web site
> >http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> >for additional information, or contact Keach Sasamori at [log in to unmask]
> >or 847-615-7100 ext.2815
> >-----------------------------------------------------
> >
> >---------------------------------------------------
> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
> >unsubscribe, send a message to [log in to unmask] with following text in
> >the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
> >(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
> >Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
> >posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
> >archives of previous posts at: http://listserv.ipc.org/archives Please
> >visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
> >additional information, or contact Keach Sasamori at [log in to unmask] or
> >847-615-7100 ext.2815
> >-----------------------------------------------------
> >
> >---------------------------------------------------
> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> >To unsubscribe, send a message to [log in to unmask] with following text in
> >the BODY (NOT the subject field): SIGNOFF Technet
> >To temporarily halt or (re-start) delivery of Technet send e-mail to
> >[log in to unmask]: SET Technet NOMAIL or (MAIL)
> >To receive ONE mailing per day of all the posts: send e-mail to
> >[log in to unmask]: SET Technet Digest
> >Search the archives of previous posts at:
http://listserv.ipc.org/archives
> >Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> >for additional information, or contact Keach Sasamori at [log in to unmask]
or
> >847-615-7100 ext.2815
> >-----------------------------------------------------
> >
> >---------------------------------------------------
> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> >To unsubscribe, send a message to [log in to unmask] with following text in
> >the BODY (NOT the subject field): SIGNOFF Technet
> >To temporarily halt or (re-start) delivery of Technet send e-mail to
> >[log in to unmask]: SET Technet NOMAIL or (MAIL)
> >To receive ONE mailing per day of all the posts: send e-mail to
> >[log in to unmask]: SET Technet Digest
> >Search the archives of previous posts at:
http://listserv.ipc.org/archives
> >Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> >for additional information, or contact Keach Sasamori at [log in to unmask]
or
> >847-615-7100 ext.2815
> >-----------------------------------------------------
> >
> >---------------------------------------------------
> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> >To unsubscribe, send a message to [log in to unmask] with following text in
> >the BODY (NOT the subject field): SIGNOFF Technet
> >To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> >To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> >Search the archives of previous posts at:
http://listserv.ipc.org/archives
> >Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> >-----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
> -----------------------------------------------------
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
