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August 2005

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Subject:
Re: RoHs board surface recommendations.
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
Wenger, George M.
Date:
Mon, 1 Aug 2005 09:07:22 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (104 lines) 
Edwin,

I'm not sure platers can give a guarantee that the boards they send are Black Pad Free because all of the evaluations I've seen that were run to determine what causes Black pad didn't show any problems.  If a plater can't intentionally generate Black Pad failures then I'm not sure how they are going to provide Black Pad Free boards until they understand the root cause.

Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Edwin Louis
Sent: Monday, August 01, 2005 8:38 AM
To: [log in to unmask]
Subject: Re: [TN] RoHs board surface recommendations.


Ask the plater for black pad free ENIG.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of George Milad
Sent: Friday, July 29, 2005 7:14 AM
To: [log in to unmask]
Subject: Re: [TN] RoHs board surface recommendations.

Do not discount ENIG.
There is data available now showing that soldering to the Ni surface at the
SAC alloy temperature conditions produces a very robust solder joint.
There are Ni baths available now that are RoHS compliant i.e. no Cd and no
PB.

Best  regards

George Milad
[log in to unmask]
National Accounts Manager  for Technology
Uyemura International Corporation
Technical Center
240  Town LIne Rd
Southington CT 06489
(516) 901 3874 (mobile)
(860)  793-4011 (office)
(860) 793-4020 (fax)

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