Perhaps the "top global CM" needs to find another board vendor. Any type
of failure in our business is catastrophic. As long as cheap, quick and
perfect have the stage, catastrophy awaits stage left. Every type of
failure is always blamed on the raw board first, maybe with cause, maybe
not. Perhaps a good percentage of the "enigmas" are not related to the
board finish. I have an opinion-you have an opinion--Agree to disagree?
At 12:24 PM 08/11/2005, you wrote:
>Well, OK, John. You are opinionated. But you sure do have some good
>opinions.
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
>Sent: Thursday, August 11, 2005 1:16 PM
>To: [log in to unmask]
>Subject: Re: [TN] <Misc>Re: [TN] RoHs board surface recommendations.
>
>Very nice,
>
>Until you consider that ENIG infringes the design rules for at least one
>of the top 3 global CM's due to the issues associated with it.
>
>If you want the number of their chief technologist who has to look at
>enigma failures week in week out I will happily supply details off line.
>
>I personally have built hundreds of thousands of assemblies on ENIG as
>well as Immersion AG.
>
>As for the rest, HASL is generally failure related to a complete lack of
>understanding of tin thickness and intermetallic growth rate, OSP
>failures generally are related to not understanding the degradation of
>that finish with multiple reflow cycling, and personally I would never
>use immersion tin without some type of diffusion barrier between it and
>the copper if nay time in storage was to be considered.
>
>The ENIG when it fails can be catastrophic............and in most cases
>can be pointed back to the process at the fab house rather than what
>happened to it during the assembly process, unlike most of the other
>finish defects, and has to my knowledge resulted in multi million dollar
>lawsuits between companies in the bay area due to failures.
>
>If it doesn't fail - it is fine, but the joint shear strength is less
>than the equivalent HASL or immersion AG finish due to the Tin
>nickel/nickel copper crystalline structure, so taking into consideration
>the higher temperatures of lead free I would be vary careful using it
>for area array packages using this soldering technology.
>
>For the record have been using immersion silver since 1996 as I produced
>the first beta site production runs using alpha level, so perhaps my
>views have a little more history.
>
>Call me opinionated - I'll take it.
>
>John
>
>
>
>
>
>
>
>------------------------------------
>Avanex
>John Burke
>Senior Manager RoHS Compliance
>[log in to unmask]
>40919 Encyclopedia Circle
>Fremont
>CA 94538
>tel: 510 897 4250
>fax: 510 979 0189
>mobile: 510 676 6312
>------------------------------------
>
>
>-----Original Message-----
>From: Steve Hodge [mailto:[log in to unmask]]
>Sent: Thursday, August 11, 2005 10:44 AM
>To: TechNet E-Mail Forum; John Burke
>Subject: Re: <Misc>Re: [TN] RoHs board surface recommendations.
>
>
>John, come on now. Anything can happen at any time. I have seen some
>reservations from the IS users as to silver migration possibilities and
>shelf life/handling issues --you might say they have not seen them
>--"yet".
>I have had more problems with HASL, OSP and IT than I have with ENIG.
>ENIG has longer data history than IS, so both shoes have already dropped
>so to speak. Three years without problems, is an eternity in this
>business, especially when we are expected to build custom products in
>24 hours.
>
>
>At 11:00 AM 08/11/2005, you wrote:
> >with it............YET..........
> >
> >------------------------------------
> >Avanex
> >John Burke
> >Senior Manager RoHS Compliance
> >[log in to unmask]
> >40919 Encyclopedia Circle
> >Fremont
> >CA 94538
> >tel: 510 897 4250
> >fax: 510 979 0189
> >mobile: 510 676 6312
> >------------------------------------
> >
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]]On Behalf Of Edwin Louis
> >Sent: Thursday, August 11, 2005 4:48 AM
> >To: [log in to unmask]
> >Subject: Re: [TN] RoHs board surface recommendations.
> >
> >
> >We have been using ENIG now for about three years and have had no bad
> >experiences with it. NASA for one does not allow the use of silver .
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
> >Sent: Wednesday, August 10, 2005 4:57 PM
> >To: [log in to unmask]
> >Subject: Re: [TN] RoHs board surface recommendations.
> >
> >Hi Steve,
> >I do not know about "bad-mouth ENIG"--I am a reliability consultant,
> >and have had plenty of calls because of ENIG related failures, but not
> >a one about iAg. On the other hand, I do not know about their
> >respective environmental implications.
> >
> >Regards,
> >Werner Engelmaier
> >Engelmaier Associates, L.C.
> >Electronic Packaging, Interconnection and Reliability Consulting
> >7 Jasmine Run
> >Ormond Beach, FL 32174 USA
> >Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
> >E-mail: [log in to unmask], Website: www.engelmaier.com
> >
> >
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