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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Thu, 11 Aug 2005 11:48:57 -0700
Content-Type:
text/plain
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text/plain (218 lines)
And I'll bet the name of the chemistry you are using starts with an A

------------------------------------
Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
Fremont
CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
------------------------------------


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Hodge
Sent: Thursday, August 11, 2005 11:37 AM
To: [log in to unmask]
Subject: Re: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface
recommendations.


Yes Richard, you are right on with the process control part. Every process
has to be controlled. The BGA and blackpad thing. I do not understand the
correllation. I have many thousands of heavily populated BGA designs out
there in serviceland--no black pad problem--ever --in house or at the
customer. It is not just luck either. LOL


At 12:22 PM 08/11/2005, you wrote:
>Steve and John,
>I think it is safe to say that ENIG is a good finish, but it
>depends......(sorry, Doug).
>It depends on the fab house or plater, how well they control the plating
>process to prevent the issues. It also depends on the type of assembly
>and its use. However, it is such a difficult process to control that it
>is hard to say when the issues will appear. But eventually they probably
>will, for any user, from any vendor. It is still very much a viable
>option for those who are afraid of potential problems with immersion
>silver or any other surface finish.
>But on the other hand I myself hesitate to re-qualify something if it
>isn't broken. If you have an assembly with ENIG, and you get it from a
>board vendor who seems to be able to do it consistently without
>problems, it would certainly not be wise to change.
>I just know that I would not recommend ENIG for an assembly populated
>with BGA's. Especially if the assembly is going to see a service life
>exposed to high thermal cycling. This is where the dreaded Black Pad
>problem seems to thrive.
>I know that the aerospace industry has not accepted immersion silver,
>but it is only a matter of time.
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Hodge
>Sent: Thursday, August 11, 2005 12:44 PM
>To: [log in to unmask]
>Subject: Re: [TN] <Misc>Re: [TN] RoHs board surface recommendations.
>
>John, come on now. Anything can happen at any time. I have seen some
>reservations from the IS users as to silver migration possibilities and
>shelf life/handling issues --you might say they have not seen them
>--"yet".
>I have had more problems with HASL, OSP and IT than I have with ENIG.
>ENIG has longer data history than IS, so both shoes have already dropped
>so to speak. Three years without problems, is an eternity in this
>business, especially when we are expected to build  custom products in
>24 hours.
>
>
>At 11:00 AM 08/11/2005, you wrote:
> >with it............YET..........
> >
> >------------------------------------
> >Avanex
> >John Burke
> >Senior Manager RoHS Compliance
> >[log in to unmask]
> >40919 Encyclopedia Circle
> >Fremont
> >CA 94538
> >tel: 510 897 4250
> >fax: 510 979 0189
> >mobile: 510 676 6312
> >------------------------------------
> >
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]]On Behalf Of Edwin Louis
> >Sent: Thursday, August 11, 2005 4:48 AM
> >To: [log in to unmask]
> >Subject: Re: [TN] RoHs board surface recommendations.
> >
> >
> >We have been using ENIG now for about three years and have had no bad
> >experiences with it. NASA for one does not allow the use of silver .
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
> >Sent: Wednesday, August 10, 2005 4:57 PM
> >To: [log in to unmask]
> >Subject: Re: [TN] RoHs board surface recommendations.
> >
> >Hi Steve,
> >I do not know about "bad-mouth ENIG"--I am a reliability consultant,
> >and have had plenty of calls because of ENIG related failures, but not
> >a one about iAg. On the other hand, I do not know about their
> >respective environmental implications.
> >
> >Regards,
> >Werner Engelmaier
> >Engelmaier Associates, L.C.
> >Electronic Packaging, Interconnection and Reliability Consulting
> >7 Jasmine Run
> >Ormond Beach, FL 32174 USA
> >Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
> >E-mail: [log in to unmask], Website: www.engelmaier.com
> >
> >
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