Well, OK, John. You are opinionated. But you sure do have some good
opinions.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Thursday, August 11, 2005 1:16 PM
To: [log in to unmask]
Subject: Re: [TN] <Misc>Re: [TN] RoHs board surface recommendations.
Very nice,
Until you consider that ENIG infringes the design rules for at least one
of the top 3 global CM's due to the issues associated with it.
If you want the number of their chief technologist who has to look at
enigma failures week in week out I will happily supply details off line.
I personally have built hundreds of thousands of assemblies on ENIG as
well as Immersion AG.
As for the rest, HASL is generally failure related to a complete lack of
understanding of tin thickness and intermetallic growth rate, OSP
failures generally are related to not understanding the degradation of
that finish with multiple reflow cycling, and personally I would never
use immersion tin without some type of diffusion barrier between it and
the copper if nay time in storage was to be considered.
The ENIG when it fails can be catastrophic............and in most cases
can be pointed back to the process at the fab house rather than what
happened to it during the assembly process, unlike most of the other
finish defects, and has to my knowledge resulted in multi million dollar
lawsuits between companies in the bay area due to failures.
If it doesn't fail - it is fine, but the joint shear strength is less
than the equivalent HASL or immersion AG finish due to the Tin
nickel/nickel copper crystalline structure, so taking into consideration
the higher temperatures of lead free I would be vary careful using it
for area array packages using this soldering technology.
For the record have been using immersion silver since 1996 as I produced
the first beta site production runs using alpha level, so perhaps my
views have a little more history.
Call me opinionated - I'll take it.
John
------------------------------------
Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
Fremont
CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
------------------------------------
-----Original Message-----
From: Steve Hodge [mailto:[log in to unmask]]
Sent: Thursday, August 11, 2005 10:44 AM
To: TechNet E-Mail Forum; John Burke
Subject: Re: <Misc>Re: [TN] RoHs board surface recommendations.
John, come on now. Anything can happen at any time. I have seen some
reservations from the IS users as to silver migration possibilities and
shelf life/handling issues --you might say they have not seen them
--"yet".
I have had more problems with HASL, OSP and IT than I have with ENIG.
ENIG has longer data history than IS, so both shoes have already dropped
so to speak. Three years without problems, is an eternity in this
business, especially when we are expected to build custom products in
24 hours.
At 11:00 AM 08/11/2005, you wrote:
>with it............YET..........
>
>------------------------------------
>Avanex
>John Burke
>Senior Manager RoHS Compliance
>[log in to unmask]
>40919 Encyclopedia Circle
>Fremont
>CA 94538
>tel: 510 897 4250
>fax: 510 979 0189
>mobile: 510 676 6312
>------------------------------------
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of Edwin Louis
>Sent: Thursday, August 11, 2005 4:48 AM
>To: [log in to unmask]
>Subject: Re: [TN] RoHs board surface recommendations.
>
>
>We have been using ENIG now for about three years and have had no bad
>experiences with it. NASA for one does not allow the use of silver .
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
>Sent: Wednesday, August 10, 2005 4:57 PM
>To: [log in to unmask]
>Subject: Re: [TN] RoHs board surface recommendations.
>
>Hi Steve,
>I do not know about "bad-mouth ENIG"--I am a reliability consultant,
>and have had plenty of calls because of ENIG related failures, but not
>a one about iAg. On the other hand, I do not know about their
>respective environmental implications.
>
>Regards,
>Werner Engelmaier
>Engelmaier Associates, L.C.
>Electronic Packaging, Interconnection and Reliability Consulting
>7 Jasmine Run
>Ormond Beach, FL 32174 USA
>Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
>E-mail: [log in to unmask], Website: www.engelmaier.com
>
>
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