Steve and John,
I think it is safe to say that ENIG is a good finish, but it
depends......(sorry, Doug).
It depends on the fab house or plater, how well they control the plating
process to prevent the issues. It also depends on the type of assembly
and its use. However, it is such a difficult process to control that it
is hard to say when the issues will appear. But eventually they probably
will, for any user, from any vendor. It is still very much a viable
option for those who are afraid of potential problems with immersion
silver or any other surface finish.
But on the other hand I myself hesitate to re-qualify something if it
isn't broken. If you have an assembly with ENIG, and you get it from a
board vendor who seems to be able to do it consistently without
problems, it would certainly not be wise to change.
I just know that I would not recommend ENIG for an assembly populated
with BGA's. Especially if the assembly is going to see a service life
exposed to high thermal cycling. This is where the dreaded Black Pad
problem seems to thrive.
I know that the aerospace industry has not accepted immersion silver,
but it is only a matter of time.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Hodge
Sent: Thursday, August 11, 2005 12:44 PM
To: [log in to unmask]
Subject: Re: [TN] <Misc>Re: [TN] RoHs board surface recommendations.
John, come on now. Anything can happen at any time. I have seen some
reservations from the IS users as to silver migration possibilities and
shelf life/handling issues --you might say they have not seen them
--"yet".
I have had more problems with HASL, OSP and IT than I have with ENIG.
ENIG has longer data history than IS, so both shoes have already dropped
so to speak. Three years without problems, is an eternity in this
business, especially when we are expected to build custom products in
24 hours.
At 11:00 AM 08/11/2005, you wrote:
>with it............YET..........
>
>------------------------------------
>Avanex
>John Burke
>Senior Manager RoHS Compliance
>[log in to unmask]
>40919 Encyclopedia Circle
>Fremont
>CA 94538
>tel: 510 897 4250
>fax: 510 979 0189
>mobile: 510 676 6312
>------------------------------------
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of Edwin Louis
>Sent: Thursday, August 11, 2005 4:48 AM
>To: [log in to unmask]
>Subject: Re: [TN] RoHs board surface recommendations.
>
>
>We have been using ENIG now for about three years and have had no bad
>experiences with it. NASA for one does not allow the use of silver .
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
>Sent: Wednesday, August 10, 2005 4:57 PM
>To: [log in to unmask]
>Subject: Re: [TN] RoHs board surface recommendations.
>
>Hi Steve,
>I do not know about "bad-mouth ENIG"--I am a reliability consultant,
>and have had plenty of calls because of ENIG related failures, but not
>a one about iAg. On the other hand, I do not know about their
>respective environmental implications.
>
>Regards,
>Werner Engelmaier
>Engelmaier Associates, L.C.
>Electronic Packaging, Interconnection and Reliability Consulting
>7 Jasmine Run
>Ormond Beach, FL 32174 USA
>Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
>E-mail: [log in to unmask], Website: www.engelmaier.com
>
>
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