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August 2005

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Subject:
From:
Hal Winslow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hal Winslow <[log in to unmask]>
Date:
Tue, 2 Aug 2005 15:02:49 -0400
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I'm looking for what fab houses would consider to be the minimum sized
capture pad for a drilled hole in a PCB if acceptability is specified
per IPC 600 Class 3.  

 

For instance, when specifying a .010 via (+0, -.010 finished hole size)
what size pad should I design in so that you can hit the minimum .002
annular ring required for Class 3?

 

I believe that I have heard drill size plus .014 for the pad size.

 

Bonus points will be awarded if there is a difference between inner and
outer layer pad size and you detail that for me...

 

Thanks!

Hal Winslow


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