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August 2005

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Subject:
From:
Stephen R Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stephen R Gregory <[log in to unmask]>
Date:
Wed, 31 Aug 2005 13:43:17 -0500
Content-Type:
text/plain
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text/plain (83 lines)
                                When my gas exchange rate is high, I always hope my system is
                                closed, praying that there won't be any deposition...

                                -Steve-

                                Beat ya' to that one Dewey...hehehe






        Paul Edwards <[log in to unmask]>
                        Sent by: TechNet <[log in to unmask]>
                        08/31/2005 12:48 PM
                        Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Paul Edwards <[log in to unmask]>
                                	
        To:     [log in to unmask]@SMTP@Exchange
        cc:     (bcc: Stephen R Gregory/LABARGE)
        Subject:        Re: [TN] ENIG/ Immersion Gold Plating and Pre-baking & Solderability	


                                It could and probably does but the total gas exchange rate is so high (
                                since it is not a closed system) that there is probably no deposition
                                like there could be a closed system.

                                Paul 

                                Paul Edwards
                                Process Engineering
                                [log in to unmask]
                                Tel: 408-433-4700
                                FAX: 408-433-9988
                                Surface Art Engineering
                                81Bonaventura Dr.
                                San Jose, CA 95134
                                DUNS: 944740570
                                CAGE/NCAGE: 1XZ48

                                -----Original Message-----
                                From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard
                                Sent: Wednesday, August 31, 2005 10:37 AM
                                To: [log in to unmask]
                                Subject: Re: [TN] ENIG/ Immersion Gold Plating and Pre-baking &
                                Solderability

                                You mean like in a nitrogen reflow oven? :) 


                                            




















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