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Thu, 25 Aug 2005 07:29:59 -0700 |
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Hi Steve,
For gold wire bonding, we use both full electrolytic and electroless
processes. That is Electrolytic Ni/Electrolytic Au and Electroless
Ni/Electroless Au. We haven't tried Electroless Ni/Electrolytic Au or
Electrolytic Ni/Electroless Au. Not sure if that would ever come up.
Thickness, purity, and hardness are the key to good bondability with gold.
Glenn
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Thursday, August 25, 2005 6:31 AM
To: [log in to unmask]
Subject: [TN] Wire bondable gold
Good day to all,
Does it make any difference if the nickel underneath the wire bondable gold
is electroplated or electroless? Thanks in advance. Steve Kelly
PFC Flexible Circuits Limited
Ph: (416) 750-8433
Fax: (416) 750-0016
Cell: (416) 577-8433
E-Mail: [log in to unmask]
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