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Date: | Mon, 1 Aug 2005 07:41:50 -0500 |
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Should one have to? I would think that was a given. Perhaps we should
put that on the DFM checklist as well.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Edwin Louis
Sent: Monday, August 01, 2005 7:38 AM
To: [log in to unmask]
Subject: Re: [TN] RoHs board surface recommendations.
Ask the plater for black pad free ENIG.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of George Milad
Sent: Friday, July 29, 2005 7:14 AM
To: [log in to unmask]
Subject: Re: [TN] RoHs board surface recommendations.
Do not discount ENIG.
There is data available now showing that soldering to the Ni surface at
the SAC alloy temperature conditions produces a very robust solder
joint.
There are Ni baths available now that are RoHS compliant i.e. no Cd and
no PB.
Best regards
George Milad
[log in to unmask]
National Accounts Manager for Technology Uyemura International
Corporation Technical Center 240 Town LIne Rd Southington CT 06489
(516) 901 3874 (mobile)
(860) 793-4011 (office)
(860) 793-4020 (fax)
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