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August 2005

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Subject:
From:
Kristi Howe <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 5 Aug 2005 16:39:48 -0500
Content-Type:
text/plain
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text/plain (22 lines)
George,
As a solder Instructor, I have found that pre-heating the board before
trying to remove the component seems to work.  This brings the heat of the
module up slower and reduces the amount of stress fractures caused by
direct heat.
I would try a Hakko 853 preheater.  Heat for @ 1 minute, then de-solder.

Kristi Howe
Solder Instructor, TRW Automotive
902 South Second Street
Marshall, Illinois 62441
(217) 826-2311
[log in to unmask]

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