George,

As we transition to Lead-Free we have tested about 8 different cored
wire solders.  Interestingly enough the winner for OA is not the same
manufacturer as the winner of no-clean.  Is the solder you are using the
best you found in testing?  We had one that didn't want to leave the
soldering iron tip.

If you have not changed your bare board spec to use a higher Tg and CAF
resistant material I would expect you to potentially have some rework
issues especially if the board has seen multiple temperature cycles.

Phil 

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of George Carroll
Sent: Friday, August 05, 2005 8:48 AM
To: [log in to unmask]
Subject: [LF] Lead-free Through hole and repair

Our solder trainer has had considerable difficulty trying to develop a
suitable method for the repeatably successful removal of lead-free
through hole components, especially multi-leaded components.  The
problem is that application of sufficient heat may crack the knee of the
hole at the pad.  I have two questions: first, do any of you have
insights to the solution of this problem and second, do you feel that
the Class 2   (0.8 mil) through hole requirement for plated copper is
sufficient to stand the additional thermal stress of a no-lead repair of
an FR-4, 0.062 thk assembly?


George Carroll
Process Engineer, EPIC Technologies, LLC
P.O. Box 1255
3000 Bill Garland Road
Johnson City, Tennessee 37605
(423) 461-2948
[log in to unmask]

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