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August 2005

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Subject:
From:
"Smith, Rick" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 4 Aug 2005 08:35:02 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (201 lines)
Yes we are using LF components, have had to adjust design rules to cover
proper hole/pin ratio for lack of hasl.

Thanks for the info, I had never heard of it before.

Rick Smith
Senior Product/ Component Engineer
 
Phone: (512)652-3544
Fax:     (512)652-3545
Cell:     (512)299-6925
Email:   [log in to unmask]
 
ClearCube Technology, Inc
8834 Capital of Texas Hwy N
Austin, TX 78759
 
www.clearcube.com
 

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Dennis Bang
Sent: Wednesday, August 03, 2005 9:17 PM
To: [log in to unmask]
Subject: Re: [LF] Press-fit terminations

Hi Rick,

Because Nickel is not as ductile as copper there's a risk of barrel
cracking
especially with the higher insertion force requirements for LF finish on
the
component (relative to SnPb). Are you using LF components?

<after adjusting drill size to get finished hole size to spec>
Does this mean you had issues prior?

If the finished PTH size can be controlled within spec, then as far as I
know there's no reason why you can't press-fit ENIG boards.

It was just interesting from the "Panel Discussion", there's no mention
of
ENIG for Press-fit applications.


Rgds
Dennis.

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Smith, Rick
Sent: Wednesday, 3 August 2005 11:55 PM
To: [log in to unmask]
Subject: Re: [LF] Press-fit terminations


I'm curious, who told you ENIG is not good for press-fit?

We have not experienced any problems with ENIG/ Press-fit (after
adjusting drill size to get finished hole size to spec).

Please elaborate,

thanks

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Dennis Bang
Sent: Tuesday, August 02, 2005 9:35 PM
To: [log in to unmask]
Subject: Re: [LF] Press-fit terminations

Further to this, I found a panel discussion which lists Immersion Ag and
OSP
has issues with the Press-fit compatibility, and there was no mention of
ENIG compatibility with press fit. Is this because it's a given that you
just don't use ENIG for press fit? What was the reason why Imm-Ag was
found
incompatible with Press-fit while other sources have stated otherwise?

http://www.smta.org/files/SMTAI04_surface_finishes_panel.pdf#search='sur
face
%20finishes%20%20issues%20past%20present'


Can anyone shed some light on this??


>  -----Original Message-----
> From:         Dennis Bang
> Sent: Monday, 1 August 2005 6:18 PM
> To:   Lead Free Forum (E-mail)
> Subject:      Press-fit terminations
>
> Hi fellow technetters
>
>
> From previous discussions on this topic, OSP and Im-Sn are recommended
as
> the PCB finish.
>
http://listserv.ipc.org/scripts/wa.exe?A2=ind0402&L=leadfree&P=R328&I=-3
>
http://listserv.ipc.org/scripts/wa.exe?A2=ind0401&L=leadfree&P=R5429&I=-
3
>
> This info was in 2004. Have there been any updates since for the
preferred
> PCB finish for Pressfit applications? Has anyone used or trialed Lead
Free
> HASL for press-fit connectors? Any issues?
>
>
> Regards
> Dennis.

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informing us of the error, so that we may continue to improve our
processes.
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sending them on.
Thank you.
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