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Subject:	Re: 96.5% Tin / 3.5% Silver vs. SAC305
From:	David Suraski <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Wed, 3 Aug 2005 14:49:44 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (46 lines)

... and don't forget the silver phase change problems and poorer
mechanical fatigue resistance as compared to Sn/Ag/Cu.

Regards,
David Suraski
AIM 

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of MA/NY DDave
Sent: Wednesday, August 03, 2005 2:38 PM
To: [log in to unmask]
Subject: Re: [LF] 96.5% Tin / 3.5% Silver vs. SAC305

Hi KEDS-Rich, John, SPVC, IPC LF Listservers

Stopping for a minute on this fun discussion/learning experience.

If you decide to use 96.5Sn you do know that your soldering temperature
will be higher and you might have component MSL problems. I know it is
only a few degrees yet you don't have lots of margin on some of your
products.


YiEngr, MA/NY DDave

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