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August 2005

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Subject:
From:
"Munie, Gregory" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 1 Aug 2005 11:32:25 -0500
Content-Type:
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text/plain (80 lines)
Rich

Thanks for the kudos!

I would think it would act similarly. But not having data that's only an
opinion.

FYI: iNEMI is starting wave solder set of testing and I believe they are
looking at that alloy. You might check their web site. SPVC has talked about
doing a similar study but it hasn't got off the ground yet.

Greg



-----Original Message-----
From: Richard Kraszewski [mailto:[log in to unmask]]
Sent: Monday, August 01, 2005 9:18 AM
To: [log in to unmask]
Subject: [LF] 96.5% Tin / 3.5% Silver vs. SAC305


Just reviewed the IPC SPVC report on the SAC alloys.  2 thumbs up on
that effort!!!  Now for the question at hand.



Seeing that there seemed to be little performance difference amongst the
3 alloys being considered, what if you go one step further.  Would all
of you think that an alloy such as 96.5 Sn/3.5 Ag would perform equally
well?  Sure the melt point is ~ 4 degC higher , but with some copper
contamination whether it be in a TH or SM, won't you think the
performance would be very similar to say SAC305?



Reason I'm asking is that I'm supporting some 96.5% Tin / 3.5% Silver
processes, and need to determine if I switch them over to SAC305 or let
them continue as they are.



Your thoughts would be appreciated.



Rich K KEDS












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