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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Mon, 1 Aug 2005 11:32:25 -0500 |
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Rich
Thanks for the kudos!
I would think it would act similarly. But not having data that's only an
opinion.
FYI: iNEMI is starting wave solder set of testing and I believe they are
looking at that alloy. You might check their web site. SPVC has talked about
doing a similar study but it hasn't got off the ground yet.
Greg
-----Original Message-----
From: Richard Kraszewski [mailto:[log in to unmask]]
Sent: Monday, August 01, 2005 9:18 AM
To: [log in to unmask]
Subject: [LF] 96.5% Tin / 3.5% Silver vs. SAC305
Just reviewed the IPC SPVC report on the SAC alloys. 2 thumbs up on
that effort!!! Now for the question at hand.
Seeing that there seemed to be little performance difference amongst the
3 alloys being considered, what if you go one step further. Would all
of you think that an alloy such as 96.5 Sn/3.5 Ag would perform equally
well? Sure the melt point is ~ 4 degC higher , but with some copper
contamination whether it be in a TH or SM, won't you think the
performance would be very similar to say SAC305?
Reason I'm asking is that I'm supporting some 96.5% Tin / 3.5% Silver
processes, and need to determine if I switch them over to SAC305 or let
them continue as they are.
Your thoughts would be appreciated.
Rich K KEDS
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