The report is useful and good news for the industry as a whole in that

it says that there is no practical difference in SMT assembly between

SAC305 which seems to be gaining the favourite spot in Japan and US due

mainly to lower Ag content, and the SAC387 which appears to be possibly

more favoured in UK and Europe due perhaps to original selection of the

IDEALS project. Its clear however with issues over various Pb-free

solder patents etc that the solder companies do have a vested interest

in having the industry use mostly one standard alloy and would obviously

prefer their customer to choose the one which suits their business

better.



I'm intrigued that this thread says that the NEMI report into Pb-F wave

soldering is not testing the SAC387 alloy only the SAC305 against the

patented SnCu+X variants. Does anyone know why this is? We decided to go

with SAC for all our processes and chose SAC387 for wave and selective

because it is somewhat closer to the SAC eutectic than SAC305, going

with the same selection basis that we use SnPb 63/37 instead of the

cheaper 60/40, and that the plastic range would be less affected by

copper pick-up than SAC305.



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