Thanks Dave, Bob and others for your inputs.
It has been a most insightful discussion!
Most Appreciated!! Thanks !!
Rgds
Dennis.
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of MA/NY DDave
Sent: Wednesday, 17 August 2005 1:24 PM
To: [log in to unmask]
Subject: Re: [LF] Press-fit terminations
Hi Dennis, Hilty, IPC LF Listservers,
I hope you enjoyed reading the Tyco report.
For your question on shelf life, I would still consider OSP although Bob
noted differently. You can always chemically redo the OSP and bring it back
up to good solderability. Depending on your storage time and conditions
this can be an advantage, when you need it. (The hole size will grow a tad)
OSP depending on user or long held beliefs has some publicity problems. For
short term shelf life, if only insertion force, removal, retention, were my
goals, I would probably go with Bob's other more co-planar recommendations.
Yours in Engineering, Dave
YiEngr, MA/NY DDave
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