LEADFREE Archives

August 2005

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Subject:
From:
"Cosentino, Tony" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 17 Aug 2005 06:35:06 -0500
Content-Type:
text/plain
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text/plain (62 lines)
Dave, 
I have heard of Palladium over Nickel for wire bond boards but the
problem with Electroplated Palladium or Electroless Palladium over
Nickel for a soldered assembly (other than the cost) is the Palladium
boards display a reduced hole fill and surface mount pad wetting quickly
after the first pass through the SMT process.
Most people who still use Palladium put a final gold layer over the
Palladium such as Electroless Nickel / Electroless Palladium / Immersion
Gold or Electroless Palladium / Immersion Gold.
Thanks
Tony Cosentino
Tekelec
[log in to unmask]
919-460-3656

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of MA/NY DDave
Sent: Tuesday, August 16, 2005 10:39 PM
To: [log in to unmask]
Subject: [LF] PWB (Board) finishes: Pal

Hi IPC LF Listservers,

In an article I recently gave a link for, there was a section on Board
(PWB) finishes for Lead-free.

I have never heard of Palladium or Palladium over Nickel as a board
finish.
I do know about Palladium used in component lead, and lead frame
finishes so I think it was an author mistake.

SO - - -, Does anyone know of Palladium or Palladium over Nickel as a
board finish??


Yours in Engineering, Dave
YiEngr, MA/NY DDave

P.S. Yes I have written the magazine editor, yet I also wanted to ask
here.

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